Thermal Solution

How does thermal radiation tape differ from standard thermal interface pads?

Standard thermal interface pads (TIPs) conduct heat from a component into a heatsink or chassis — they reduce contact resistance between two surfaces that are already pressed together. Thermal radiation tape works differently: the copper film layer spreads heat laterally across a wider area, and the RH3 radiation paint coating actively releases heat into the surrounding air by radiation. This makes it the correct choice when there is no heatsink to conduct heat into — for example, flat battery surfaces, PCB component areas with no adjacent thermal mass, or LED strips mounted on non-metallic substrates. The two products address different thermal management problems and are not interchangeable.

What is emissivity and why does it matter for heat dissipation?

Emissivity is a measure of how efficiently a surface radiates heat as infrared energy relative to a perfect radiator (emissivity = 1.0). The SA-CN series achieves emissivity values of 0.84–0.86 via the RH3 radiation paint coating. By comparison, bare copper or aluminum surfaces have emissivity values around 0.03–0.10 — they are poor radiators. The high-emissivity coating on these tapes increases the rate of heat radiation by approximately 8–25× compared to the underlying copper surface alone, which is why the copper film layer achieves active cooling rather than just heat spreading.

What is the thermal conductivity of the SA-CN series thermal tape?

The SA-CN series achieves thermal conductivity values of 120–130 W/m·K, with SA-CN2003 and SA-CN2004 at the higher end of this range. This is well above standard pressure-sensitive thermal tapes (typically 1–3 W/m·K), driven by the copper film layer which is the primary conduction path. The high conductivity adhesive layer reduces interfacial thermal resistance at the bond surface. Confirm the specific grade for your application as thermal conductivity values vary across the five SA-CN models.

Can thermal radiation tape be die-cut into custom pad shapes?

Yes. The SA-CN series is available in slit rolls and can be precision die-cut into pads, strips, and custom shapes to drawing dimensions. Total tape thickness is only 50–60 μm, which requires precision tooling to cut cleanly without adhesive smear or edge tearing. ALS Tape handles die-cutting in-house. Provide your pad dimensions, required grade, and target volume to request a quote.

Is thermal radiation tape suitable for EV battery module thermal management?

The SA-CN2004 grade (60 μm, gray, 0.84 emissivity, 120 W/m·K) is specified for power electronics and EV battery module applications. Its thicker copper layer (25 μm vs 15 μm in other grades) provides greater lateral heat spreading across battery cell surfaces, and the high adhesion (1500 gf/25mm) ensures durable bond to cell exterior surfaces across thermal cycling. It is not a substitute for a direct liquid cooling plate or phase change thermal pad where direct conduction to a controlled temperature surface is required — it is used where passive radiation from cell surfaces supplements or replaces other thermal management.

What is the total thickness and adhesion strength of these thermal tapes?

Total tape thickness is 50 μm for SA-CN2001/2002/2003 grades and 60 μm for SA-CN2004/AN2005 grades. This thin profile allows integration into compact device assemblies where standard thermal gap pads (typically 0.5–3 mm thick) do not fit. Adhesion is 1500 gf/25mm across all grades — the same adhesion level as 3M VHB tape — providing secure, durable bonding to metal and smooth plastic surfaces without additional fasteners.