Metal Foils & Plastic Films
Metal foils (aluminum, copper) and plastic films (BOPET, BOPP, metallized PET) for barrier packaging, EMI shielding, thermal management, and reflective insulation applications.
Converting Options
Overview
ALS Tape supplies and converts metal foils and plastic films for barrier, shielding, insulation, and packaging applications. Aluminum and copper foils provide absolute barriers to light, oxygen, and moisture, with natural electrical conductivity and dead-fold characteristics that allow them to conform to complex shapes. Aluminum foil is widely used in thermal insulation facings, EMI shielding, and reflective insulation systems. Copper foil is the standard substrate for PCB traces, grounding straps, and conductive EMI shielding tape. Biaxially oriented polyester film (BOPET) provides high tensile strength, dimensional stability, and heat resistance for packaging, labels, and electrical insulation. Biaxially oriented polypropylene film (BOPP) offers excellent moisture barrier and optical clarity for packaging and label applications. Metallized films produced by vacuum deposition of aluminum onto plastic film substrates combine the flexibility and light weight of plastic with the barrier and reflective properties of metal, enabling cost-efficient barrier packaging and reflective insulation constructions. Functional coatings including silicone release, anti-static, and adhesion primer are available on film substrates.
Material Types
Aluminum foil for thermal insulation, EMI shielding, and barrier packaging
Copper foil for PCB, grounding, and conductive EMI shielding tape
BOPET (polyester) film for tensile strength, heat resistance, and insulation
BOPP film for moisture barrier, clarity, and packaging
Metallized PET and BOPP for hybrid barrier and reflective insulation
Key Properties
Aluminum foil thickness: 6 µm to 200 µm
BOPET tensile strength: up to 200 MPa
Metallized film barrier: >60 dB EMI shielding effectiveness
Available forms: rolls, slit widths, laminated constructions, and converted parts
Applications
EMI and RFI shielding tape for electronics enclosures and cable wrapping
Thermal insulation facing and reflective radiant barrier systems
Flexible PCB substrate and grounding strap constructions
Barrier packaging for moisture-sensitive and light-sensitive materials
Dielectric and insulation film layers in capacitors and transformers
Related Products
FAQ
What is the difference between aluminum foil tape and metallized film?
Aluminum foil tape uses solid aluminum foil as the substrate, providing full metallic barrier, dead-fold conformability, and higher conductivity. Metallized film uses a very thin vacuum-deposited aluminum layer on a plastic film, offering lighter weight and more flexibility at lower cost, but with reduced conductivity and barrier compared to solid foil.
When is copper foil tape used instead of aluminum?
Copper foil tape is used when solderability is required, or when the EMI shielding path needs to connect to a soldered ground point. Aluminum is not solderable with standard tin-lead or SAC solders, making copper the standard for electronics EMI shielding requiring electrical contact.
Can plastic films be supplied with functional coatings?
Yes. BOPET and BOPP films are available with silicone release coatings, anti-static treatments, and adhesion primer coatings to enable downstream converting, lamination, and adhesive coating processes.
Material Inquiry
Metal Foils & Plastic Films
Metal foils (aluminum, copper) and plastic films (BOPET, BOPP, metallized PET) for barrier packaging, EMI shielding, thermal management, and reflective insulation applications.