Products

Semicon Process

Semiconductor process tapes and packaging materials for wafer, dicing, masking, and clean packaging applications.

Semicon Process

This category covers two distinct stages of the semiconductor workflow. Semiconductor Process Tape is used during the dicing step — UV-release adhesive holds the wafer or substrate to the ring frame and releases cleanly after UV exposure. Semiconductor Packaging Tray is used after processing — IC carrier trays and waffle packs protect components during handling, storage, and shipment. Select the product that matches your workflow stage, or contact us if you need guidance.

UV Dicing / Backgrind

Semiconductor Process Tape

ARIS No.6360 UV dicing tape — polyolefin base, UV-release adhesive for wafer, substrate, glass, and LED dicing. 11 variants covering standard, high-adhesion, easy pick-up, and high-expandability.

UV Dicing TapeARIS 6360Wafer Dicing

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IC Carrier Tray / Waffle Pack

Semiconductor Packaging Tray

IC carrier trays and waffle packs for semiconductor component handling, storage, and transport — clear waffle trays, flip-top carriers, and JEDEC black trays for BGA, LED, QFN, and bare die.

IC Carrier TrayWaffle PackSemiconductor Packaging

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Semicon Process

Semiconductor process tapes and packaging materials for wafer, dicing, masking, and clean packaging applications.

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