1 / 2Semiconductor Process Tape
ARIS No.6360 series UV dicing tape — polyolefin base, UV-release adhesive for wafer, substrate, glass, and LED dicing. Low contamination, high expandability, easy chip pickup after UV irradiation.
Brand / Series
ARIS — No.6360 series UV dicing tape
Base Material
Polyolefin (PO) — eco-friendly, highly isotropic
Adhesive Type
UV-release acrylic adhesive
Thin Series Thickness
85–110μm total (wafer dicing)
Overview
ALS Tape supplies ARIS No.6360 series UV dicing tape for semiconductor wafer and substrate dicing processes. The tape uses a UV-release adhesive coated onto a highly isotropic polyolefin (PO) base film. During dicing, the tape firmly secures the workpiece; after UV irradiation, adhesion drops dramatically for clean, residue-free chip pickup. The polyolefin base material is eco-friendly and provides controlled expandability for die separation after dicing. Two product lines are available: the thin-base series (85–110μm total) for wafer dicing, and the thick-base series (150–170μm total) for substrate, glass, and LED dicing applications. Within each line, variants cover standard, high-adhesion, easy pick-up, chipping-limited, and high-expandability requirements. The process sequence supported is: tape mount → dicing → UV irradiation → chip pickup.
Category Focus
Semicon Process
Semiconductor process tapes and packaging materials for wafer, dicing, masking, and clean packaging applications.
View source documentTypical Grades and Specification Direction
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| Series / Model | Thickness | Adhesive Type | Liner | Profile | Typical Use |
|---|---|---|---|---|---|
| 6360-00 | 100μm (90+10) | UV-release | PO base | Standard | General wafer dicing |
| 6360-05 | 95μm (90+5) | UV-release | PO base | Limits chipping | Chipping-sensitive wafer dicing |
| 6360-20 | 100μm (90+10) | UV-release | PO base | High adhesion | Secure hold for hard-to-dice materials |
| 6360-50 | 100μm (90+10) | UV-release | PO base | Easy pick-up | Fast chip pickup after UV |
| 6368-00 | 85μm (80+5) | UV-release | PO base | High expandability | Die expansion for small-pitch chips |
| 6360-15 | 160μm (150+10) | UV-release | PO base | Standard — Substrate/Glass/LED | Substrate and glass panel dicing |
| 6360-25 | 160μm (150+10) | UV-release | PO base | High adhesion | High-adhesion substrate dicing |
| 6360-55 | 160μm (150+10) | UV-release | PO base | Easy pick-up | Fast pickup — substrate/glass/LED |
| 6360-95 | 170μm (150+20) | UV-release | PO base | High adhesion + Easy pick-up | Demanding LED and glass dicing |
| 6365-61 | 150μm (140+10) | UV-release | PO base | Limits burr + Easy pick-up | Burr-sensitive substrate/glass dicing |
| 6365-62 | 160μm (140+20) | UV-release | PO base | High adhesion + Easy pick-up + Limits burr | High-performance glass/LED dicing |
Key Features
UV-Release Adhesive — Firmly holds workpiece during dicing (initial peel 0.88–4.10 N/10mm); adhesion drops to 0.07–0.30 N/10mm after UV irradiation for clean residue-free chip pickup.
Polyolefin (PO) Base Film — Eco-friendly, highly isotropic base provides controlled expandability and consistent dicing performance across wafer, substrate, glass, and LED applications.
Low Surface Contamination — Specially designed adhesive minimizes surface residue on diced chips and substrates after UV release and pickup.
Two Thickness Lines — Thin series (85–110μm) for wafer dicing; thick series (150–170μm) for substrate, glass, and LED dicing.
Variant Selection — Standard, high-adhesion, easy pick-up, chipping-limited, burr-limited, and high-expandability variants within the same base series.
Stable Long-Term Performance — Peel strength stable through storage; UV release performance maintained after extended tape laminate storage (up to 2 years tested).
Applications
Silicon wafer dicing for semiconductor chip manufacturing
Substrate and glass panel precision dicing
LED wafer and chip dicing with burr and chipping control
Back-grinding tape mount and UV release for wafer thinning processes
Die expansion after dicing for small-pitch chip separation
Clean room tape supply for semiconductor front-end and back-end processes
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