1 / 2Semiconductor Process Tape
Semiconductor process tape for UV dicing and wafer handling workflows where controlled adhesion, clean removal, and converting accuracy are required.
Primary product direction
UV dicing tape for semiconductor process handling
Typical workflow fit
Wafer dicing, temporary hold, backgrind support, and semiconductor converting steps
Supply support
Slit rolls, custom widths, and process-matched tape formats
Overview
ALS Tape supplies semiconductor process tape for wafer dicing, temporary holding, backgrind support, and downstream semiconductor converting steps. UV dicing tape is the primary direction — these tapes provide consistent adhesion during wafer dicing and controlled release after UV exposure, enabling clean pick-up without contamination. Material selection is typically driven by wafer size, process sequence, required adhesion level before UV exposure, and release behavior after UV cure. ALS can support sample evaluation, slit supply, and converted tape formats for process development or production use.
Category Focus
Semicon Process
Semiconductor process tapes and packaging materials for wafer, dicing, masking, and clean packaging applications.
View source documentKey Features
UV dicing tape for controlled adhesion during wafer dicing and clean release after UV exposure
Suitable for temporary hold during semiconductor process handling and backgrind support
Focused on clean handling, contamination control, and consistent peel behavior
Available in slit and process-matched tape formats to wafer size and process requirements
Applications
Wafer dicing support with controlled UV-release adhesion
Temporary hold during semiconductor process handling
Backgrind and related wafer support workflows
Clean-room tape supply for semiconductor manufacturing
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