1 / 4Semiconductor Packaging Tray
IC carrier trays and waffle packs for semiconductor component handling, storage, and transport — clear waffle trays, flip-top carriers, and JEDEC-style black plastic trays for BGA, LED, QFN, and bare die components.
Tray Types
Clear waffle packs / Flip-top clamshell carriers / Black JEDEC carrier trays
Supported Components
LED chips, bare die, BGA, QFN, CSP, and packaged IC formats
Material
Clear or black plastic — ESD-compatible grades available
Inspection Access
Clear lid / flip-top formats allow visual inspection without removing components
Overview
ALS Tape supplies semiconductor packaging trays and component carriers used in IC manufacturing, assembly, and distribution workflows. The product range covers clear plastic waffle packs with precision-molded grid recesses for individual chip placement, flip-top clamshell carriers for inspection and controlled access, and black JEDEC-standard carrier trays for surface-mount and packaged component handling. These packaging formats protect semiconductor components from mechanical damage, contamination, and electrostatic discharge during wafer-level and package-level processing, inter-process transfer, and finished component shipment. Tray configurations are matched to specific package types and chip sizes, supporting BGA, LED chip, QFN, bare die, and multi-format semiconductor components. Clean handling and traceability requirements are built into the tray selection criteria for advanced manufacturing and semiconductor assembly programs.
Category Focus
Semicon Process
Semiconductor process tapes and packaging materials for wafer, dicing, masking, and clean packaging applications.
Key Features
Clear Waffle Packs — Precision-molded transparent plastic trays with individual grid recesses for chip placement. Allows visual inspection of components without opening. Used for LED chips, bare die, and small IC components.
Flip-Top Clamshell Carriers — Hinged clear-lid carriers for controlled access, component inspection, and protected handling of populated chip arrays during inter-process transfer.
Black JEDEC Carrier Trays — Standard black plastic carrier trays for packaged ICs, BGA, QFN, and surface-mount components. Compatible with automated handling equipment and tape-and-reel conversion workflows.
ESD and Contamination Protection — Tray materials and formats selected to meet semiconductor handling requirements for electrostatic discharge protection and particulate contamination control.
Matched to Package Type — Tray geometry matched to specific chip package dimensions, body size, and array configuration for secure, repeatable placement.
Traceability and Labeling — Carrier tray formats support lot identification, date code labeling, and component tracking through assembly and distribution workflows.
Applications
LED chip storage and inter-process transfer during semiconductor assembly
Bare die and BGA component handling in advanced IC packaging programs
QFN and CSP component packaging for transport and distribution
Wafer-level component inspection and controlled-access storage
Clean room packaging for contamination-sensitive semiconductor components
Finished component shipment packaging with traceability and lot labeling
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