1 / 4Semiconductor Packaging Material
Semiconductor packaging material portfolio covering EMI shielding, electrical isolation, and clean handling formats for advanced electronics and semiconductor package-level assembly.
Primary application directions
Package-level EMI shielding and electrical insulation in advanced semiconductor assembly
Typical selection criteria
Shielding target, thickness budget, package architecture, cleanliness, and assembly temperature
Typical supply forms
Roll stock, slit formats, die-cut patches, and laminated supporting layers
Overview
ALS Tape supplies semiconductor packaging materials for package-level shielding, electrical isolation, and clean handling in advanced electronics manufacturing. Applications in this area are typically qualified by package architecture, shielding target, assembly temperature, thickness budget, and whether the material is supplied as roll stock, converted patch, or laminated component. EMI shielding at the package level and insulating layers between components are the primary application directions. ALS can supply these materials as slit roll stock, die-cut patches, laminated layers, and clean packaged output for prototype or production programs.
Category Focus
Semicon Process
Semiconductor process tapes and packaging materials for wafer, dicing, masking, and clean packaging applications.
View source documentKey Features
Package-level EMI shielding material for semiconductor assembly applications
Electrical isolation layers between components in advanced electronics packages
Clean handling and controlled delivery formats for contamination-sensitive semiconductor workflows
Available as slit rolls, die-cut patches, laminated layers, and clean packaged output
Applications
Package-level EMI shielding in advanced semiconductor assemblies
Electrical isolation layers in multi-component electronics packages
Clean handled patches and laminated supporting parts for semiconductor assembly
Prototype material builds for package development and qualification
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