1 / 2LCP Flexible Film
TCI Low-Loss LCP (Liquid Crystal Polymer) film for next-generation high-frequency PCBs — ultra-low Dk/Df, <0.05% water absorption, Pb-free solder compatible. Engineered for 5G antennas, radar, satellite, and telecom infrastructure.
Material
TCI Low-Loss LCP (Liquid Crystal Polymer) Film
Dielectric Constant (Dk)
3.3 @ IPC-TM-650 2.5.5.15
Dissipation Factor (Df)
<0.0020 @ IPC-TM-650 2.5.5.15
Water Absorption
<0.05%
Overview
ALS Tape supplies TCI Low-Loss LCP Film — a high-performance liquid crystal polymer film engineered for next-generation high-frequency PCB applications where signal integrity and low dielectric loss are critical. The film is designed for circuitply, bondply, and coverlay applications in both flexible and rigid PCB constructions, and can be laminated with smooth copper foils or alternative substrates to create customized high-performance PCB solutions. LCP film delivers an extremely low dielectric constant (Dk 3.3) and dissipation factor (Df <0.0020), enabling faster signal transmission and wider bandwidth compared to conventional PCB dielectric materials. Water absorption is below 0.05%, ensuring stable electrical properties in high-humidity and high-frequency environments — a critical requirement for outdoor antenna and satellite applications. The material provides excellent chemical resistance to acids, bases, solvents, and fuels, and is Pb-free solder compatible with solder heat resistance to 270°C. ALS can supply LCP film in roll format and provide converting services to production-ready dimensions.
Category Focus
Electrical Insulation
Flexible and composite electrical insulation laminates for motor, transformer, and electronics applications.
View source documentKey Features
Ultra-Low Dielectric Loss — Dk 3.3 / Df <0.0020 (IPC-TM-650 2.5.5.15), enabling faster signal transmission and wider bandwidth in high-frequency circuit designs.
Extremely Low Water Absorption — <0.05%, ensuring stable Dk/Df performance in humid environments and outdoor deployments typical of antenna and satellite applications.
Pb-Free Solder Compatible — Solder heat resistance to 518°F (270°C), suitable for lead-free reflow soldering processes used in modern PCB assembly.
Excellent Copper Adhesion — Peel strength 1.0 KN/m (IPC-TM-650 2.4.9), enabling reliable lamination with smooth copper foils for circuitply and bondply constructions.
Dimensional Stability — CTE 10 ppm, Elastic Modulus 5 GPa, Tensile Strength 129 MPa — mechanically stable through PCB processing and thermal cycling.
RoHS Compliant — Environmentally friendly, halogen-free construction meeting green and ROHS requirements for global electronics manufacturing.
Applications
5G antenna substrate and high-frequency flexible circuit construction
Radar and satellite communication PCB dielectric layers
Telecom infrastructure flexible and rigid-flex PCB applications
Circuitply, bondply, and coverlay constructions for high-speed signal layers
Copper-clad laminate base for customized high-performance PCB solutions
High-humidity and outdoor-deployed electronics requiring stable dielectric performance
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